Prof. Xinxin Li，The presentation addresses a semiconductor-foundry compatible MEMS process on a single (111) silicon wafer. The innovative process has been continually developed and progressed to form several versions for fabrication of various MEMS sensors like barometers, differential pressure sensors, accelerometers, micro flow-meters, infrared detectors, TPMS sensors, resonant biochemical sensors and PM2.5 detectors, etc. The process can be widely used and always features simple, low-cost, high yield, high-performance and high 3D fabrication capability.
Aoki Kazuya,USHIO INC. System Solution Division
Su Koukou.jpg Dr. Koukou Suu, ULVAC, Inc.执行役员/资深研究员
Dr. Koukou Suu,主题为“应用于IoT/IoE压电材料的薄膜加工技术”在薄膜功能材料，如压电材料（PbZzTiO3、AlN、ScAlN）或者金属绝缘转变材料（VOx）已被用于先进的MEMS传感器与RF器件（FBAR / BAW）面向实现物联网解决方案。在本次演讲中，Dr. Koukou Suu报告新型溅射工艺用于高性能CMOS兼容技术的PZT薄膜技术的开发成果。
李贻昆教授演讲题目为“From CMOS MEMS Thermal Sensors to Smart HVAC Control System for Energy-Efficient Buildings with Artificial Intelligence”报告重点讲到目前世界人口已超过73亿，2100年将增加到约112亿。人口问题造成全球能源及环境变化巨变（如超级台风），因此开发具有可持续发展低碳的新型节能技术至关重要。如能在2050年之前节省2 Gt二氧化碳，可避免全球极端气候变化所带来的灾害。另一方面，过去六十年来半导体业进步使得低成本高性能集成电路能大量用于各个行业。物联网（IoT）是半导体的新兴重要技术，根据国际消費電子展CES首席经济学家研究，传感器是物联网的五大重要技术之一。低成本 MEMS传感器已大量应用在智能手机及汽车，本次演讲介绍如何将微热传及流体力学用于开发CMOS MEMS热流传感器的设计理论模型及非线性SPICE模型，用于CMOS MEMS集成设计优化，计算效率比电脑数值模型快一百万倍。并用CMOS/CMOS MEMS晶圆代工厂工艺设计及制造。优化的集成热流传感器、ASIC电路及MCU数字信号处理算法可大幅增加输入流速的测量范围，从0.5 mm / s（可用于提高HVAC系统性能）到73 m / s（用于空气动力学测量，高于超强台风的速度）。另外先进MEMS流量传感器和传感器融合技术(sensor fusion)，用于开发出新型能量（BTU）传感器和热舒适度（PMV）传感器，其性能比比商业热舒适度仪好一个数量级。研制的CMOS MEMS热流传感器也用于HKUST-MIT国际研究计划，开发基于PMV传感器及人工智能的节能HVAC控制系统。
Toko Miura，Silicon Sensing Product
Toko Miura，Silicon sensing systems Ltd is a 50% 50% joint venture, with its parent company "Sumitomo Precision Products" in Japan and "Collins Aerospace" in the United States, which manufactures and sells MEMS gyro sensors, acceleration, and MEMS foundry services.There are gyro sensors manufactured by our company in the Inductive, Capacitive, and Piezoelectric types, and Pinpoint is a gyro sensor using the third type of PZT piezoelectric thin film.The combination of the PZT piezoelectric system and the ring Si oscillator has excellent bias output stability with substantially no deterioration in gyro performance even in a vibration environment.Our PZT thin films have been improved for many years.Although it is generally considered that film quality control is difficult for PZT thin films, its management technology and individual adjustments in the die state succeeded in mass production of PZT gyros.By optimizing the upper electrode and adopting the ALD multilayer film, reliability can be maintained even at a voltage three times the conventional
Shuji Tanaka，Tohoku University/Professor General Co-Chair
PZT-based MEMS gyroscopes and inkjet printer heads have been commercialized by Japanese companies many years before. Since then, there was almost no new kind of PZT-based MEMS commercialized. Recently, several new kinds of PZT-based MEMS including micromirror, microspeaker and varifocal lens are getting commercialized. This is partly because the reliability of PZT films has been improved and partly because PZT-based MEMS foundry services have been matured. What is the next wave? It may be made by single crystal (epitaxial) PZT films, exhibiting both high piezoelectric constant and low dielectric constant. One of promising applications is pMUT.Another new wave of piezoelectric microdevices is the advancement of SAW devices using a single crystal LiTaO3 or LiNbO3 film on a support substrate, followed by rapid growth of BAW and SAW filters. A new type of SAW device, Hetero Acoustic Layer (HAL) SAW device, using thin LiTaO3 on bulk quartz has achieved a very high impedance ratio (k2×Q), near-zero TCF and spurious-free response. The HAL SAW filters are promising for difficult-to-deal bands, complex carrier aggregation and sub-6 GHz 5G communication.
朱钰演讲题目“IMEC 特色工艺：MEMS和微光机电系统/传感器”Imec is your perfect partner for your MEMS and tailored device development.Integrated optical readouts for MEMS show promise as alternative to capacitive or piezoelectric counterparts:We detailed MOMPS concepts and realizations as well as some architectural considerations.We demonstrated the dynamic behavior of MOMPS as highly arrayable microphones.