IEEE CAS Society IEEE SSCS Shanghai Chapter IET Shanghai Network Chinese Institute of Electronics
2019 13th IEEE International Conference on ASIC (ASICON 2019) will be held in Chongqing, China, during Oct.29-Nov.1, 2019. The conference is intended to provide an international forum for Integrated circuit designers, ASIC users, system integrators, IC manufacturers, process and device engineers, and CAD/CAE tool developers to present their latest progress, development and research results in their respective fields. The four-day event features keynote speeches, invited talks, regular paper presentations and tutorials, delivered by leading experts in the respective fields, on state-of-the-art Integrated circuits, design methodologies, devices, processes and manufacturing technologies. The Excellent Student Paper award will be announced at the conference. Additionally, an exhibition on EDA tools, foundry technologies, IC processing/testing facilities, and novel ASIC products will be held during the conference.
The Scope of the Conference
Papers are solicited in, but not limited to, the following:
I. Integrated Circuits and Design Techniques:
 Analog IC
 Digital IC
 Wireless, Wireline telecommunication and Optic Communication IC
 Sensor, Image Processing and Bio-medical IC
 FPGA and DSP
 Special application IC
 Design for Testing
II. CAD Techniques
 Circuits Simulation, Synthesis, Verification and Physical Design
 CAD for System, Design for Manufacturing and Testing
III. New Techniques, New Processing, New Devices and Their Applications
 MEMS Techniques
 Nanoelectronics and Gigascale Systems
 New Devices: Heterojunction Devices, Fin FET, CNT MTJ Devices, 3-D Integration, etc.
 New Processing: Advanced Interconnection Technology, High-K/Metal, Gate Technology and Other VLSL New Processing
 Processing Modeling & Simulation
IV. Other VLSI Design and Device Related Topics
 Other Devices Related Topics
 Other VLSI Design Related Topics
Prospective authors are requested to submit full-length papers in English of no more than four pages using the proceedings format, double columned, 10pt fonts including figures, tables and references. For further information on the paper format, please refer to “template”. The papers are submitted in their final form , if accepted, will be published as submitted. All submissions must be made at the conference website. Student authors, who want to compete for the Excellent Student Paper Award, should apply at the conference website. Detailed instructions for paper preparation and submission can be found at conference website.
Deadline of papers submittal is June 30, 2019.
Paper acceptance/rejection will be informed by Aug. 15, 2019
Jan Van der Spiegel
Advisory Committee Co-Chairs:
Program Committee Co-Chairs:
Organizing Committee Co-Chairs:
Prof. Huihua Yu asicon_org @fudan.edu.cn (about conference)
Prof. FanYe email@example.com (about program)