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Final Call For Papers-2019 13th IEEE International Conferenc


Oct 25, 2021
来源: 半导体行业观察

Sponsored by IEEE Beijing Section
Co-Sponsored by Fudan University   Chongqing University
Patrons by IEEE CAS Society   IEEE SSCS Shanghai Chapter   IET Shanghai Network   Chinese Institute of Electronics 


2019 13th IEEE International Conference on ASIC (ASICON 2019) will be held in Chongqing, China, during Oct.29-Nov.1, 2019. The conference is intended to provide an international forum for Integrated circuit designers, ASIC users, system integrators, IC manufacturers, process and device engineers, and CAD/CAE tool developers to present their latest progress, development and research results in their respective fields. The four-day event features keynote speeches, invited talks, regular paper presentations and tutorials, delivered by leading experts in the respective fields, on state-of-the-art Integrated circuits, design methodologies, devices, processes and manufacturing technologies. The Excellent Student Paper award will be announced at the conference. Additionally, an exhibition on EDA tools, foundry technologies, IC processing/testing facilities, and novel ASIC products will be held during the conference.

The Scope of the Conference 

Papers are solicited in, but not limited to, the following:
I. Integrated Circuits and Design Techniques:
   [1] Analog IC
   [2] Digital IC
   [3] Wireless, Wireline telecommunication and Optic Communication IC
   [4] Memory
   [5] Sensor, Image Processing and Bio-medical IC
   [6] FPGA and DSP
   [7] Special application IC
   [8] Design for Testing   
II. CAD Techniques
   [9] Circuits Simulation, Synthesis, Verification and Physical Design 
   [10] CAD for System, Design for Manufacturing and Testing
III. New Techniques, New Processing, New Devices and Their Applications
   [11] MEMS Techniques 
   [12] Nanoelectronics and Gigascale Systems 
   [13] New Devices: Heterojunction Devices, Fin FET, CNT MTJ Devices, 3-D Integration, etc.
   [14] New Processing: Advanced Interconnection Technology, High-K/Metal, Gate Technology and Other VLSL                New Processing 
   [15] Processing Modeling & Simulation
IV. Other VLSI Design and Device Related Topics
   [16] Other Devices Related Topics 
   [17] Other VLSI Design Related Topics

Papers Submission

Prospective authors are requested to submit full-length papers in English of no more than four pages using the proceedings format, double columned, 10pt fonts including figures, tables and references. For further information on the paper format, please refer to “template”. The papers are submitted in their final form , if accepted, will be published as submitted. All submissions must be made at the conference website. Student authors, who want to compete for the Excellent Student Paper Award, should apply at the conference website. Detailed instructions for paper preparation and submission can be found at conference website. 

Deadline of papers submittal is June 30, 2019.
Paper acceptance/rejection will be informed by Aug. 15, 2019       


General Co-Chairs:
Jan Van der Spiegel
Ting-Ao Tang
Yong Lian
Zhiliang Hong
Xiaoping Zeng 

Advisory Committee Co-Chairs: 
Chenming Hu 
Omar Wing
Hiroshi Iwai
Satoshi Goto
Qianling Zhang 

Program Committee Co-Chairs:
Yinyin Lin
Hidetoshi Onodera 
Bin Zhao
Jason Woo
Jyi-Tsong Lin
Francois Rivet
Yi Zhao 

Organizing Committee  Co-Chairs:
Mengqi Zhou
Huihua Yu
Min Liu 

Industry Liaison:  
Peng Hu 

Publicity Chair: 
Mengqi Zhou 

Fan Ye 


Contact persons:
Prof. Huihua Yu   asicon_org @fudan.edu.cn  (about conference)
Prof. FanYe   fanye@fudan.edu.cn (about program) 

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